Material-enabled systems
Advanced materials, composite tooling, adhesive and foam systems, non-lethal and dual-use defense applications, and material-enabled products designed around real operational needs.
I am a founder, inventor, and hard-technology operator with more than three decades of experience building companies around advanced manufacturing, MEMS, RF systems, optoelectronics, defense electronics, and materials-enabled technologies.
Hard-technology company building requires technical depth, operating judgment, and the ability to move from invention to funded program to manufactured product. My work sits across several connected areas.
Advanced materials, composite tooling, adhesive and foam systems, non-lethal and dual-use defense applications, and material-enabled products designed around real operational needs.
RF and microwave systems, advanced packaging, passive RF concepts, radar-related technologies, frequency-selective structures, and electronics designed for demanding defense and industrial environments.
Microfabrication, wafer-level packaging, precision 3D metal micromachining, optoelectronics, MEMS-based assemblies, and manufacturing systems for complex technical products.
More than 125 issued patents worldwide across RF systems, advanced packaging, optoelectronics, MEMS, materials, and related hard-technology fields.
Experience developing technical concepts into funded programs, proposals, prototypes, test plans, documentation packages, and customer-facing program execution.
Formation, scaling, financing, restructuring, and operating of hard-technology companies, including prior venture-backed growth, strategic partnerships, acquisitions, and post-acquisition technical leadership.
Recovery, evaluation, and redeployment of laboratory, process, semiconductor, analytical, and industrial equipment into new operating environments.
Selected publications and references include work in functional electronics density, cloud and precipitation radar, three-dimensional metal micromachining, RF and microwave structures, and wafer-level packaging technology.
Virginia Polytechnic Institute and State University
M.S., Electrical Engineering, 1996
Virginia Tech
B.S., Physics, 1992
B.A., Philosophy, 1993