Areas of expertise

Where the work sits.

Hard-technology company building requires technical depth, operating judgment, and the ability to move from invention to funded program to manufactured product. My work sits across several connected areas.

Defense materials

Material-enabled systems

Advanced materials, composite tooling, adhesive and foam systems, non-lethal and dual-use defense applications, and material-enabled products designed around real operational needs.

Defense electronics

RF, microwave, and electronics

RF and microwave systems, advanced packaging, passive RF concepts, radar-related technologies, frequency-selective structures, and electronics designed for demanding defense and industrial environments.

Microfabrication

MEMS and advanced manufacturing

Microfabrication, wafer-level packaging, precision 3D metal micromachining, optoelectronics, MEMS-based assemblies, and manufacturing systems for complex technical products.

IP & strategy

Invention, patents, and technical strategy

More than 125 issued patents worldwide across RF systems, advanced packaging, optoelectronics, MEMS, materials, and related hard-technology fields.

Programs

Defense R&D and program execution

Experience developing technical concepts into funded programs, proposals, prototypes, test plans, documentation packages, and customer-facing program execution.

Operations

Company formation and technical operations

Formation, scaling, financing, restructuring, and operating of hard-technology companies, including prior venture-backed growth, strategic partnerships, acquisitions, and post-acquisition technical leadership.

Industrial

Industrial asset recovery

Recovery, evaluation, and redeployment of laboratory, process, semiconductor, analytical, and industrial equipment into new operating environments.

Career history

From first company to current portfolio.

1996 — 2003
ACT MicroDevices / Haleos
First company · acquired by Rohm and Haas Electronic Materials
I began my company-building career after completing my M.S. in Electrical Engineering at Virginia Tech in 1996. My first company, originally ACT MicroDevices and later Haleos, developed MEMS-based fiberoptic components and optoelectronic assemblies. The company grew from a founder-built manufacturing operation into a venture-backed technology business with a significant patent portfolio, ISO quality systems, and advanced optoelectronic packaging technology. Haleos was acquired by Rohm and Haas Electronic Materials in 2003.
2003 — 2006
PolyStrata technical foundation
After the acquisition, I joined Rohm and Haas Electronic Materials in a product development and R&D leadership role. During this period, I contributed to advanced packaging and microfabrication technologies, including the technical foundation that became associated with the PolyStrata platform. PolyStrata enabled precision three-dimensional metal micromachining for RF, microwave, and millimeter-wave applications. The technology was advanced through major DARPA programs, including the 3D-MERFS program (3D Microelectrical RF Systems), and became an important platform for high-performance RF and microwave hardware.
2006 — 2019
Nuvotronics — Founder & CEO
Acquired by Cubic Corporation, 2019
In July 2006, I founded Nuvotronics to commercialize advanced RF, radar, wireless, and microwave technologies for defense, space, and telecommunications applications. As President and CEO, I helped build a multidisciplinary technical and manufacturing team, develop advanced products, win contracts and awards from defense and space customers, and scale the company's manufacturing and quality systems. Nuvotronics grew into a recognized millimeter-wave technology company with facilities in Virginia, North Carolina, Boston, and Los Angeles. The company achieved AS9100D certification and shipped advanced hardware for demanding aerospace and defense applications. The underlying RF and microwave platform advanced through all three phases of the DARPA 3D-MERFS program (3D Microelectrical RF Systems), received the DARPA Innovation Award following Phase III execution, and was scaled from research demonstration into a qualified manufacturing process — adopted into hardware shipped by major U.S. defense primes, space programs, and commercial test-and-measurement vendors such as Keysight. The process later extended into large-panel fabrication and surface-mount components. Nuvotronics was acquired by Cubic Corporation in 2019.
2019 — Present
NuvoNexus — Founder & CEO
Current operating portfolio
After the Nuvotronics acquisition, I returned to company building through NuvoNexus, the portfolio platform for my current operating work. Current operating interests include MacroVation, focused on defense materials and material-enabled systems; Helicon Defense, focused on defense electronics and passive RF concepts; Phoenix Asset Recovery, focused on industrial equipment recovery and redeployment; and advisory work around deep-tech company formation and technical diligence.
By the numbers

Track record

2
Prior company exits
30+
Years operating in hard technology
Publications & references

Selected work.

Selected publications and references include work in functional electronics density, cloud and precipitation radar, three-dimensional metal micromachining, RF and microwave structures, and wafer-level packaging technology.

Education

Academic background.

Virginia Polytechnic Institute and State University
M.S., Electrical Engineering, 1996

Virginia Tech
B.S., Physics, 1992
B.A., Philosophy, 1993