Inventor on a worldwide portfolio spanning defense and commercial hardware: 3D metal micromachining, hermetic optoelectronic packaging, mm-wave waveguide structures, RF interconnects, MEMS devices, and advanced materials. Inventor records generally list the name David W. Sherrer II.
The portfolio is concentrated in process, packaging, RF, MEMS, and materials architectures that track the company-building arc.
The PolyStrata family: multilayer build processes, coaxial waveguide microstructures, hollow-core coaxial cables, and substrate-free interconnected mechanical structures. Originated at Nuvotronics and became foundational to mm-wave RF hardware adopted by major DARPA-funded primes and commercial test-and-measurement vendors including Keysight.
High-frequency power combiners and dividers, broadband antenna arrays, waveguide baluns, transmission-line architectures, and integrated RF interconnects.
Wafer-level packaging for high-speed optoelectronics, hermetic laser packages, device-package fabrication and test methods, and solder-flow control structures.
Fiber arrays with wick-stop trenches, MEMS-based optical components, silicon micromachining structures, and micro-optic assemblies from the Haleos and ACT MicroDevices era.
Formulations for electronic-device packaging, dielectric structures, and process chemistries supporting hermetic and 3D-fabricated assemblies.
Filings span Haleos, Shipley, Rohm and Haas Electronic Materials, Nuvotronics, Cubic Corporation, BAE Systems, and Samsung Electronics, reflecting program-by-program collaborations across the career.
The complete record is publicly searchable. The links below pre-filter the major patent databases by inventor name.
Note: third-party indexes can return results for similarly named inventors. The portfolio summarized here covers David W. Sherrer II, the inventor name used on patent filings, across Haleos, Shipley / Rohm and Haas, Nuvotronics, Cubic, and related assignees.
A selection of trade articles, interviews, peer-reviewed conference papers, and press coverage spanning the full arc from MEMS optoelectronics to PolyStrata mm-wave commercialization and the Cubic acquisition.
Several earlier publications — “Improving Electronics' Functional Density”, “Three-Frequency Cloud and Precipitation Radar”, and “Wafer-Level Packaging Technology for 10 Gbps TOSAs” — are referenced in older biographical materials but do not have stable public URLs and are omitted here.